Circuit-component-containing module
US7382628B2 · kind B2 · utility
7Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 4, 2003 |
| Grant date | Jun 3, 2008 |
| Priority date | — |
| Expiry date | Sep 4, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit component built-in module is provided in which a solder that is remelted when the circuit component built-in module is mounted on a motherboard by using the solder is prevented from flowing to the outside of the prescribed electrodes.A first groove (116) is formed in a solder resist (106) located between two electrodes (103) to which a circuit component (104) is connected. A configuration is used in which the space between the first groove (116) and circuit component (104) is filled with a first insulating resin (107).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.