Chemical mechanical polishing compositions and methods relating thereto
US7384871B2 · kind B2 · utility
3Cited by
8References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2004 |
| Grant date | Jun 10, 2008 |
| Priority date | — |
| Expiry date | Oct 2, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09G1/04
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention provides an aqueous composition useful for polishing nonferrous metal interconnects on a semiconductor wafer comprising oxidizer, inhibitor for a nonferrous metal, complexing agent for the nonferrous metal, modified cellulose, 0.01 to 5% by weight copolymer of acrylic acid and methacrylic acid, and balance water, wherein the copolymer of acrylic acid and methacrylic acid has a monomer ratio (acrylic acid/methacrylic acid) in the range of 1:30 to 30:1 and the copolymer has a molecular weight in the range of 1K to 1000K.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.