Method and apparatus for drying a wafer, and an apparatus for cleaning and drying a wafer
US7386944B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 5, 2004 |
| Grant date | Jun 17, 2008 |
| Priority date | — |
| Expiry date | Nov 5, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method an apparatus for drying a wafer, and an apparatus for cleaning and drying a wafer are provided. In the apparatus for cleaning and drying a wafer, the wafer is dipped into a cleaning solution in a cleaning tank. The wafer is then dried using a drying gas in a drying chamber disposed over the cleaning tank. A shutter separates the cleaning tank from the drying tank. A wafer boat moves the wafer vertically between the cleaning tank and the drying tank. Nozzles for providing the cleaning solution onto the wafer are disposed at both inner sides of the drying tank. The nozzles are connected to a drying gas supply unit to alternately and periodically provide the drying gas onto the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.