Processing apparatus and substrate processing method
US7387131B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2003 |
| Grant date | Jun 17, 2008 |
| Priority date | — |
| Expiry date | Jan 31, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68792
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing apparatus for processing a substrate With a processing fluid is provided. The apparatus includes holding members 60 for holding the substrate W, a chuck member 61 for supporting the holding members 60 and a top-face member 62 approaching the substrate W to cover its surface. In arrangement, since the top-face member 62 is supported by the chuck member 61, the holding members 60 can rotate together with the top-face member 62 in one body. With this structure, it is possible to reduce the influence of particles on the substrate W and also possible to provided a low-cost substrate processing apparatus occupied as little installation space as possible.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.