Copper polishing cleaning solution
US7387964B2 · kind B2 · utility
22Cited by
6References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2003 |
| Grant date | Jun 17, 2008 |
| Priority date | — |
| Expiry date | Jun 7, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A cleaning solution for removing copper complex residues from the surface of polishing pads and wafer substrates includes an amine pH-adjusting agent, which can be a unidentate or bidentate amine compound or a quartnary ammonium hydroxide compound or an amine including an alcohol group. The cleaning solution also includes an amino acid complexing agent and an inhibitor. In a preferred embodiment, the cleaning solution has a basic pH.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.