Rapid thermal response induction heating system for platen embossing
US7388178B2 · kind B2 · utility
4Cited by
5References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 1, 2006 |
| Grant date | Jun 17, 2008 |
| Priority date | — |
| Expiry date | May 1, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2017/005
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An induction heating system for the manufacturing of optical memory microstructure, wherein the thermal cycle allows the process web to be rapidly heated to the relaxation and re-flow temperature, followed by cooling to the optimum separation temperature in under 10 seconds total process time. The rapid response heating system of the present invention may be achieved through the use of one or rotating asymmetrical induction heating coils which are embedded in the platen(s) of the embossing device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.