Method and system for vertical optical coupling on semiconductor substrate
US7389013B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2004 |
| Grant date | Jun 17, 2008 |
| Priority date | — |
| Expiry date | Sep 30, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4214
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Connection between optical fibers and optical components within a semiconductor substrate. A lens is created at the front of a semiconductor substrate. A tapered hole is created in the back of the substrate exposing part or all of the surface of the lens. An optical component is formed or affixed at the front surface of the substrate. A volume of transparent adhesive is placed in the hole, followed by an optical fiber, which is thus coupled to the surface of the lens. A light guide is created on the front of the substrate overlying the lens to direct optical signals between the optical fiber inserted in the tapered hole and the optical component on the surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.