Hai Ding
5Patents
2h-index
6Co-inventors
40Inventor score
Filing activity: Apr 28, 2003 → Mar 30, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6953925B2 | Microlens integration | Electricity | 13 | Expired |
| US7250684B2 | Circular wire-bond pad, package made therewith, and method of assembling same | Emerging Cross-Sectional Technologies | 7 | Expired |
| US7389013B2 | Method and system for vertical optical coupling on semiconductor substrate | Physics | 2 | Expired |
| US9059174B2 | Method to reduce metal fuse thickness without extra mask | Emerging Cross-Sectional Technologies | 1 | Active |
| US9443801B2 | Method to reduce metal fuse thickness without extra mask | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.