Patent · US Expired

Device and method for soldering contacts on semiconductor chips

US7389903B2 · kind B2 · utility

1Cited by

19References

12Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Robert Bergmann · Regensburg, DE
Holger Hubner · Baldham, DE

Key dates

Filing date	Mar 29, 2004
Grant date	Jun 24, 2008
Priority date	—
Expiry date	Sep 3, 2025

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/12042
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A device for soldering contacts on semiconductor chips. A chip is held on a chip mount by a chuck and is heated from a side facing away from the wafer by means of a radiation source, so that a solder applied to a side facing the wafer is melted. A flushing device, having a plate with a window, a gas channel, and a gas outlet opening for a forming gas, is arranged at the window, is fitted parallel to the wafer. The chip is moved vertically in relation to the wafer, pressed onto the wafer through the window, and soldered on by means of isothermal solidification.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.