Enhanced adhesion strength between mold resin and polyimide
US7390697B2 · kind B2 · utility
0Cited by
12References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 17, 2005 |
| Grant date | Jun 24, 2008 |
| Priority date | — |
| Expiry date | Mar 22, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A new method is provided for the interface between a stress relieve interface layer of polyimide and a thereover created layer of mold compound. The invention provides for creating a pattern in the stress relieve layer of polyimide before the layer of mold compound is formed over the stress relieve layer of polyimide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.