Method for producing a semiconductor device with pyramidal bump electrodes bonded onto pad electrodes arranged on a semiconductor chip
US7390732B1 · kind B1 · utility
6Cited by
9References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 15, 1998 |
| Grant date | Jun 24, 2008 |
| Priority date | — |
| Expiry date | Jul 15, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1579
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device capable of facilitating high density mounting at low cost without causing any defective conduction at the time of connection to a substrate, a mounting structure thereof and a method of fabrication thereof, characterized in that pyramidal bump electrodes are bonded onto pad electrodes arranged on a semiconductor chip to form the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.