Terutaka Mori
11Patents
5h-index
19Co-inventors
59Inventor score
Filing activity: Jul 15, 1998 → Sep 12, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6305230A | Connector and probing system | Physics | 35 | Expired |
| US6455335B1 | Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step | Physics | 9 | Expired |
| US7219422B2 | Fabrication method of semiconductor integrated circuit device | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6566150B2 | Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step | Physics | 8 | Expired |
| US7390732B1 | Method for producing a semiconductor device with pyramidal bump electrodes bonded onto pad electrodes arranged on a semiconductor chip | Electricity | 6 | Expired |
| US6759258B2 | Connection device and test system | Physics | 5 | Expired |
| US7351597B2 | Fabrication method of semiconductor integrated circuit device | Emerging Cross-Sectional Technologies | 5 | Active |
| US6197603A | Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step | Physics | 4 | Expired |
| US7198962B2 | Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step | Physics | 2 | Expired |
| US7285430B2 | Connection device and test system | Physics | 1 | Expired |
| US7541202B2 | Connection device and test system | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.