Unit semiconductor chip and multi chip package with center bonding pads and methods for manufacturing the same
US7391105B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 29, 2004 |
| Grant date | Jun 24, 2008 |
| Priority date | — |
| Expiry date | Dec 27, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A unit semiconductor chip and stacked semiconductor package and method of manufacturing with center bonding pads and at least one circuit layer to reduce the length of bonding. The unit semiconductor chip includes a first series of bonding wires connected to a plurality of center bonding pads of a semiconductor chip, at least one circuit layer connected to the first series of bonding wires and including a series of circuit layer wiring patterns, and a second series of bonding wires connecting the series of circuit layer wiring patterns and a series of wiring patterns. The stacked semiconductor package further includes a second series of wiring patterns, connected to the first series of wiring patterns, the a second series of wiring patterns and the series of circuit layer wiring patterns providing connections to adjacent lower and upper unit semiconductor packages, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.