Wafer support tool for heat treatment and heat treatment apparatus
US7393207B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 22, 2004 |
| Grant date | Jul 1, 2008 |
| Priority date | — |
| Expiry date | Mar 18, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67309
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a wafer support tool for heat treatment easy in working and capable of realizing reduction in cost without generating damages or slip dislocations that would be otherwise caused by high temperature heat treatment and a heat treatment apparatus. The present invention is directed to a wafer support tool for heat treatment comprising: a plurality of wafer support members for supporting a wafer to be heat treated; and a support member holder for holding the wafer support members, wherein the wafer support members each has a contact portion with the wafer, at least one of the contact portions being movable relative to the support member holder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.