Increased stand-off height integrated circuit assemblies, systems, and methods
US7393719B2 · kind B2 · utility
2Cited by
7References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2005 |
| Grant date | Jul 1, 2008 |
| Priority date | — |
| Expiry date | Apr 3, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed are integrated circuit assemblies with increased stand-off height and methods and systems for their manufacture. Methods of the invention provide for assembling a semiconductor device by aligning a die with a substrate and interposing solder between corresponding substrate and die bond pads. A lifting force is applied to the die during heating of the solder to a liquescent state, thereby increasing the stand-off height of the die above the substrate. The lifting force is maintained during cooling of the solder to a solid state, thereby forming increased stand-off height solder connections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.