Method of manufacturing suspension structure and chamber
US7393784B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 18, 2006 |
| Grant date | Jul 1, 2008 |
| Priority date | — |
| Expiry date | Dec 13, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C1/0015
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method of manufacturing a suspension structure including providing a substrate, forming a hole and a sacrificial layer filling the hole on the substrate, forming a patterned photoresist layer on the substrate and the sacrificial layer, the patterned photoresist layer exposing a part of the substrate and the sacrificial layer, forming a structure layer on the substrate, the patterned photoresist layer, and the sacrificial layer, performing a lift off process to remove the patterned photoresist layer and the structure layer above the photoresist pattern, and performing a dry etch process to remove the sacrificial layer in order to make the structure layer and the hole become the suspension structure and the chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.