Multi-layer printed circuit board comprising a through connection for high frequency applications
US7394027B2 · kind B2 · utility
31Cited by
3References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2005 |
| Grant date | Jul 1, 2008 |
| Priority date | — |
| Expiry date | Nov 4, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A high frequency multi-layer printed circuit board, according to the present invention, comprises a through connection having an impedance adapting structure surrounding the through connection and enabling an adjustment of the characteristic impedance of the through connection to a desired value. Thus, high frequency signals may be led through the printed circuit board with reduced signal deformation. The high frequency multi-layer printed circuit board is applicable for high frequency signals up to the GHz-range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.