Optical modulator module package using flip-chip mounting technology
US7394139B2 · kind B2 · utility
19Cited by
5References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2006 |
| Grant date | Jul 1, 2008 |
| Priority date | — |
| Expiry date | Jul 26, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is an optical modulator module package using a flip-chip mounting technology, in which an optical modulator device is hermetically mounted using the flip-chip mounting technology. The optical modulator device is protected from an external environment, it is easy to transmit an electrical signal to the exterior, and optical characteristics of the optical modulator device are desirably maintained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.