Temperature sensing and prediction in IC sockets
US7394271B2 · kind B2 · utility
5Cited by
10References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2006 |
| Grant date | Jul 1, 2008 |
| Priority date | — |
| Expiry date | Mar 3, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2863
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus and method are provided which preferably combines temperature sensing and prediction for more accurate temperature control of integrated circuits. An IC temperature sensing and prediction device includes a current sensing device that measures current passing through an IC, and a temperature control apparatus that measures a surface temperature of the IC. The device further includes an electronic controller that calculates the power consumed by the IC according to the measured current and adjusts the temperature of a heater or cooler responsive to the measured surface temperature and power consumption.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.