Using bilayer lithography process to define neck height for PMR
US7394621B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2004 |
| Grant date | Jul 1, 2008 |
| Priority date | — |
| Expiry date | Nov 4, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49021
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for independently forming neck height (NH) and pole width dimensions in a main pole layer of a PMR write head is described. A main pole layer with a pole tip region is formed on a bottom yoke. The pole tip region is trimmed by an ion milling process to give a pole width. A bilayer resist is patterned to form an opening with an undercut on the main pole layer. The opening uncovers the pole tip region except for an NH length adjacent to the pole tip. A top yoke comprised of CoFeN with a thickness of about 0.2 microns is deposited in the opening and the bilayer resist is removed by a lift-off process. Thereafter, a write gap layer is formed on the pole tip region and then first, second, and third write shield layers are formed above the write gap layer along the ABS.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.