Substrate manufacturing method
US7396734B2 · kind B2 · utility
3Cited by
9References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 31, 2005 |
| Grant date | Jul 8, 2008 |
| Priority date | — |
| Expiry date | Feb 14, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76259
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a method of manufacturing a bonded substrate stack by bonding the bonding surfaces of the first and second substrates, a bonding surface having a hydrophobic region and a hydrophilic region is formed by partially processing at least one of the bonding surfaces of the first and second substrates, and then the bonding surfaces of the first and second substrates are bonded to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.