Ryuji Moriwaki
9Patents
6h-index
10Co-inventors
52Inventor score
Filing activity: Dec 23, 1996 → Dec 14, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7256104B2 | Substrate manufacturing method and substrate processing apparatus | Electricity | 256 | Expired |
| US6568931B2 | Emboss pattern processing apparatus | Emerging Cross-Sectional Technologies | 20 | Expired |
| US6260887A | Method of emboss pattern process, emboss pattern processing apparatus, and embossed sheet | Emerging Cross-Sectional Technologies | 16 | Expired |
| US7642112B2 | Method of manufacturing bonded substrate stack | Electricity | 16 | Expired |
| US7368332B2 | SOI substrate manufacturing method | Electricity | 12 | Expired |
| US5958309A | Method for manufacturing thermoplastic sheets bearing embossed patterns thereon and an apparatus therefor | Performing Operations; Transporting | 9 | Expired |
| US7396734B2 | Substrate manufacturing method | Electricity | 3 | Expired |
| US5906785A | Heat-treating method of a thermoplastic resin film | Performing Operations; Transporting | 2 | Expired |
| USRE38495E1 | Method for manufacturing thermoplastic sheets bearing embossed patterns thereon and an apparatus therefor | General | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.