Semiconductor wafer, an electronic component, and a component carrier for producing the electronic component

US7397111B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Simon Jerebic · Regensburg, DE
• Jens Pohl · San Luis Obispo, US
• Horst Theuss · Wenzenbach, DE

Key dates

• Filing date: Dec 1, 2005
• Grant date: Jul 8, 2008
• Expiry date: Jun 7, 2026

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/53196
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An electronic component includes a semiconductor chip with a chip topside, an integrated circuit, and a chip backside. The chip backside includes a magnetic layer. The electronic component further includes a chip carrier with a magnetic layer on its carrier topside. At least one of the two magnetic layers is permanently magnetic such that the semiconductor chip is magnetically fixed on the chip carrier.