Enhanced rapid thermal processing apparatus and method
US7398014B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 12, 2007 |
| Grant date | Jul 8, 2008 |
| Priority date | — |
| Expiry date | Jan 12, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68728
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heating arrangement heats a first major surface of a workpiece with an illumination energy such that a first portion of the illumination energy is directly incident upon the first major surface of the workpiece and a second portion of the illumination energy is directed such that, at least initially, the second portion would miss the first major surface. A reflector, having a central opening, reflects at least some of the second portion of the illumination energy onto the peripheral edge region of the workpiece for preheating compensation. The reflector is configured for shadow-free exposure of a second, opposing major surface of the workpiece to a flash heating energy. A workpiece manipulation arrangement is described to provide for dynamic preheating movement to vary a heating profile across the workpiece and, thereafter, move the workpiece to a flash heating position. Automatic workpiece centering is featured by the manipulation arrangement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.