Mattson Technology, Inc.
🏢 View company profile →274Patents
189Active
274Granted
56Portfolio score
Filing activity: Nov 15, 1994 → Jun 27, 2024 · 39 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6315512A | Systems and methods for robotic transfer of workpieces between a storage area and a processing chamber | Emerging Cross-Sectional Technologies | 633 | Expired |
| US6451713B1 | UV pretreatment process for ultra-thin oxynitride formation | Electricity | 467 | Expired |
| US6335293B1 | Systems and methods for two-sided etch of a semiconductor substrate | Electricity | 317 | Expired |
| US6143129A | Inductive plasma reactor | Emerging Cross-Sectional Technologies | 310 | Expired |
| US5811022A | Inductive plasma reactor | Emerging Cross-Sectional Technologies | 164 | Expired |
| US6172337A | System and method for thermal processing of a semiconductor substrate | Chemistry; Metallurgy | 107 | Expired |
| US5830277A | Thermal processing system with supplemental resistive heater and shielded optical pyrometry | Electricity | 107 | Expired |
| US5534231A | Low frequency inductive RF plasma reactor | Electricity | 93 | Expired |
| US6253704A | Apparatus and method for pulsed plasma processing of a semiconductor substrate | Electricity | 92 | Expired |
| US6805139B1 | Systems and methods for photoresist strip and residue treatment in integrated circuit manufacturing | Electricity | 83 | Expired |
| US6200634A | Thermal processing system with supplemental resistive heater and shielded optical pyrometry | Electricity | 80 | Expired |
| US6849831B2 | Pulsed processing semiconductor heating methods using combinations of heating sources | Emerging Cross-Sectional Technologies | 77 | Expired |
| US5983828A | Apparatus and method for pulsed plasma processing of a semiconductor substrate | Electricity | 75 | Expired |
| US5968279A | Method of cleaning wafer substrates | Electricity | 72 | Expired |
| US6638876B2 | Method of forming dielectric films | Electricity | 71 | Expired |
| US6884719B2 | Method for depositing a coating having a relatively high dielectric constant onto a substrate | Electricity | 70 | Expired |
| US7015422B2 | System and process for heating semiconductor wafers by optimizing absorption of electromagnetic energy | Physics | 57 | Expired |
| US6395641B2 | Apparatus and method for pulsed plasma processing of a semiconductor substrate | Electricity | 57 | Expired |
| US5824604A | Hydrocarbon-enhanced dry stripping of photoresist | Physics | 54 | Expired |
| US6342691B1 | Apparatus and method for thermal processing of semiconductor substrates | Chemistry; Metallurgy | 54 | Expired |
| US10037867B2 | Inductive plasma source with high coupling efficiency | Electricity | 52 | Active |
| US6559424B2 | Windows used in thermal processing chambers | Chemistry; Metallurgy | 52 | Expired |
| US6002109A | System and method for thermal processing of a semiconductor substrate | Chemistry; Metallurgy | 52 | Expired |
| US6301434A | Apparatus and method for CVD and thermal processing of semiconductor substrates | Chemistry; Metallurgy | 52 | Expired |
| US6835278B2 | Systems and methods for remote plasma clean | Emerging Cross-Sectional Technologies | 48 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.