Material for forming fine pattern and method for forming fine pattern using the same
US7399582B2 · kind B2 · utility
10Cited by
8References
12Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 4, 2004 |
| Grant date | Jul 15, 2008 |
| Priority date | — |
| Expiry date | Jun 4, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/40
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In the method wherein a resist pattern is miniaturized effectively by applying a fine pattern forming material, the fine pattern forming material used for providing with a cured coated layer pattern, wherein development defects are reduced by water development is offered, wherein the fine pattern forming material comprises a water-soluble resin, a water-soluble crosslinking agent and water or a mixed solution consisting of water and a water-soluble organic solvent, and further comprises an amine compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.