Compliant multi-composition interconnects
US7400041B2 · kind B2 · utility
6Cited by
10References
11Claims
0Family size
Inventors
Key dates
| Filing date | Apr 26, 2004 |
| Grant date | Jul 15, 2008 |
| Priority date | — |
| Expiry date | Aug 17, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A compliant interconnect with two or more layers of metal of two or more compositions with internal stresses is described herein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.