Method for making contact with electrical contact with electrical contact surfaces of substrate and device with substrate having electrical contact surfaces

US7402457B2 · kind B2 · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Kerstin Häse · Ottobrunn, DE
• Laurence Amigues · Birkenfeld, DE
• Herbert Schwarzbauer · Munich, DE
• Norbert Seliger · Munich, DE
• Karl Weidner · Birkenfeld, DE
• Jörg Zapf · Munich, DE
• Matthias Rebhan · Riemerling, DE

Key dates

• Filing date: Sep 25, 2002
• Grant date: Jul 22, 2008
• Expiry date: May 7, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2203/1469
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A film, based on polyimide or epoxy, is laminated onto a surface of a substrate under a vacuum, so that the film closely covers the surface and adheres thereto. Contact surfaces to be formed on the surface are uncovered by opening windows in the film. A contact is established in a plane manner between each uncovered contact surface and a layer of metal. This establishes a large-surface contact providing high current density for power semiconductor chips.