Methods for pixel binning in an image sensor
US7402789B2 · kind B2 · utility
5Cited by
5References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 28, 2006 |
| Grant date | Jul 22, 2008 |
| Priority date | — |
| Expiry date | Jun 28, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/803
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Embodiments provide structures and methods for binning pixel signals of a pixel array. Pixel signals for pixels in an element of the array are binned simultaneously. Pixels in an element are located in a plurality of rows and columns. In exemplary embodiments, pixel voltage signals or pixel current signals are binned.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.