Low crosstalk substrate for mixed-signal integrated circuits
US7402884B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 10, 2006 |
| Grant date | Jul 22, 2008 |
| Priority date | — |
| Expiry date | Aug 30, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/6758
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit laminate with a metal substrate for use with high performance mixed signal integrated circuit applications. The metal substrate provides substantially improved crosstalk isolation, enhanced heat sinking and an easy access to a true low impedance ground. In one embodiment, the metal layer has regions with insulation filled channels or voids and a layer of insulator such as unoxidized porous silicon disposed between the metal substrate and a silicon integrated circuit layer. The laminate also has a plurality of metal walls or trenches mounted to the metal substrate and transacting the silicon and insulation layers thereby isolating noise sensitive elements from noise producing elements on the chip. In another embodiment, the laminate is mounted to a flexible base to limit the flexion of the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.