Optical sensor chip package
US7405456B2 · kind B2 · utility
5Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2005 |
| Grant date | Jul 29, 2008 |
| Priority date | — |
| Expiry date | Feb 1, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/806
Abstract
The present invention relates to an optical sensor chip package in a cavity of forming frame thereof and has a gap between protection layer and optical sensor chip. The optical sensor chip avoids accepting the pressure from protection layer that damage the reliability between pads and metallic traces when protection layer lay on the forming frame. It improves drawbacks of the glue pass trough the gap between optical sensor chip and pads into the optical sensor area of optical sensor chip. It improves the high process yield and reduces the height of optical sensor chip package to achieve lightly and thinly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.