Power module package structure
US7405467B2 · kind B2 · utility
8Cited by
9References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2005 |
| Grant date | Jul 29, 2008 |
| Priority date | — |
| Expiry date | Feb 7, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power module package structure is disclosed. The control circuits are fabricated on a circuit plate, instead of fabricating them directly on a main substrate. The fabrication cost is reduced because the size of the substrate is shrunk. Furthermore, the power chips are placed on a material with high thermal conductivity. The heat produced from the power chips can be transmitted quickly. Thus, the reliability of the power module package can be improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.