Image pickup device with non-molded DSP chip and manufacturing method
US7405760B2 · kind B2 · utility
7Cited by
7References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 21, 2003 |
| Grant date | Jul 29, 2008 |
| Priority date | — |
| Expiry date | Nov 30, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/92247
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An image pickup device and a manufacturing method thereof. A digital signal processing (DSP) chip is attached on a first surface of a substrate. A CMOS image sensor (CIS) chip is attached on an active surface of the DSP chip. The DSP chip and the CIS chip may be electrically connected to the substrate by wire bonding. A housing kit having a lens configured to transmit an image to the DSP chip may be mounted on the substrate. An inner space between the housing kit and the substrate is not molded, thereby simplifying a manufacturing process and providing a thinner and/or lighter image pickup device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.