Method for mounting a semiconductor chip onto a substrate
US7407084B2 · kind B2 · utility
0Cited by
18References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 5, 2005 |
| Grant date | Aug 5, 2008 |
| Priority date | — |
| Expiry date | Dec 5, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/07802
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for mounting a semiconductor chip onto a substrate the side of which facing towards the substrate is coated with an adhesive layer is characterised by the following steps:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.