Manufacturable CoWP metal cap process for copper interconnects
US7407605B2 · kind B2 · utility
8Cited by
12References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 22, 2007 |
| Grant date | Aug 5, 2008 |
| Priority date | — |
| Expiry date | May 22, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/072
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An aqueous seeding solution of palladium acetate, acetic acid and chloride.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.