Sean Smith
8Patents
5h-index
26Co-inventors
55Inventor score
Filing activity: Oct 24, 2002 → Oct 5, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7045453B2 | Very low effective dielectric constant interconnect structures and methods for fabricating the same | Electricity | 199 | Expired |
| US7023093B2 | Very low effective dielectric constant interconnect Structures and methods for fabricating the same | Electricity | 104 | Expired |
| US6975032B2 | Copper recess process with application to selective capping and electroless plating | Electricity | 51 | Expired |
| US7064064B2 | Copper recess process with application to selective capping and electroless plating | Electricity | 13 | Expired |
| US7407605B2 | Manufacturable CoWP metal cap process for copper interconnects | Electricity | 8 | Active |
| US7867897B2 | Low leakage metal-containing cap process using oxidation | Electricity | 3 | Active |
| US7598614B2 | Low leakage metal-containing cap process using oxidation | Electricity | 2 | Expired |
| US7253106B2 | Manufacturable CoWP metal cap process for copper interconnects | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.