Method of thermally coupling a flow tube or like component to a thermal sensor and sensor systems formed thereby
US7408133B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2005 |
| Grant date | Aug 5, 2008 |
| Priority date | — |
| Expiry date | Dec 8, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49004
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of thermally coupling a flow tube or like component to a thermal sensor comprises bonding the component to the thermal sensor such that thermally conductive portions formed on the component are thermally coupled to corresponding sensing/heating elements disposed on the thermal sensor. The method can be employed to form a capillary mass flow sensor system. Thermally conductive portions, such as metal bands, can be formed on the outer surface of a capillary tube for bonding with corresponding resistive heat sensing and heating elements disposed on the substrate of a micro mass flow sensor. Bonding metal pads can be formed on the sensor surface preparatory to solder bonding the tube metal bands to the resistive sensing and heating elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.