Process for the manufacture of doped semiconductor single crystals, and III-V semiconductor single crystal
US7410540B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2006 |
| Grant date | Aug 12, 2008 |
| Priority date | — |
| Expiry date | Jun 30, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC30B29/42
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In a process for manufacturing doped semiconductor single crystal comprises solidifying in a crucible, the amount of dopant is added into the semiconductor melt after the beginning of the crystal growth onto the seed crystal, or after at least partial solidification of the semiconductor single crystal in a conical or tapered portion of the crucible. Dopant may be partially added in advance into the crucible, with the remainder added into the semiconductor melt as described. Type III-V semiconductor single crystals or wafers having a diameter of at least about 100 mm, can be prepared having an electrical conductivity of at least about 250 Siemens/cm, and/or an electric resistivity of at most about 4×10−3 Ωcm, and/or a significantly improved ratio of hall mobility to charge carrier concentration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.