Process and apparatus for depositing single-component or multi-component layers and layer sequences using discontinuous injection of liquid and dissolved starting substances via a multi-channel injection unit

US7410670B2 · kind B2 · utility

Assignee

• Aixtron, Inc. · DE

Inventors

• Marcus Schumacher · Kerpen, DE
• Peter Baumann · Tirschenreuth, DE
• Johannes Lindner · Roetgen, DE
• Marc Deschler · Hauset, BE

Key dates

• Filing date: Mar 16, 2006
• Grant date: Aug 12, 2008
• Expiry date: Mar 16, 2026

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C23C16/52
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

The invention relates to a method and device for depositing at least one layer on at least one substrate in a process chamber. Said layer comprises several components and is insulating, passivating or electrically conductive. The components are vaporized in a tempered vaporization chamber by means of non-continuous injection of a liquid starting material or a starting material dissolved in a liquid using a respective injector unit. Said vapor is guided to the process chamber by means of a carrier gas. It is important to individually adjust or vary the material flow parameters, such as injection frequency and the pulse/pause ratio and the phase relation of the pulse/pauses to the pulse/pauses of the other injector unit, determining the time response of the flow of material through each injector unit. The pressure in the process chamber is less than 100 mbars, the process chamber is tempered and several series of layers are deposited on the substrate during one process step.