Optoelectronic alignment structures for the wafer level testing of optical and optoelectronic chips
US7412138B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2007 |
| Grant date | Aug 12, 2008 |
| Priority date | — |
| Expiry date | Apr 28, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4224
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
This application describes, among others, wafer designs, testing systems and techniques for wafer-level optical testing by coupling probe light to/from the top of a wafer. A wafer level test system uses optical and electronic probes to search for and align with an optoelectronic alignment structure. The test system uses a located optoelectronic alignment structure as a reference point to locate other devices on the wafer. The system tests the operation of selected devices disposed on the wafer. The optoelectronic alignment loop is also used as an alignment reference of known performance for an adjacent device of unknown performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.