Stencil device for accurately applying solder paste to a printed circuit board
US7412923B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 3, 2003 |
| Grant date | Aug 19, 2008 |
| Priority date | — |
| Expiry date | Feb 29, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/173
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A stencil device ensures that solder paste is accurately applied to a printed circuit board to create a substantially zero signal degradation solder bridge electrical connection. The printed circuit board is defined by a dielectric structure core having a first surface which further includes a first conducting pad having an edge and a second conducting edge having an edge separated from and adjacent to the edge of the first conducting pad. The edges of the first and second conducting pads define therebetween a surface area of the first surface. The stencil device includes a stencil plate member defining a first opening sized to substantially correspond to the first conducting pad, a second opening sized to substantially correspond to the second conducting pad, and a third opening. The third opening links the first opening to the second opening at a size to correspond to a partial portion of the surface area of the first surface between the edges of the first and second conducting pads. The stencil device ensures that solder paste flows through the first, second, and third openings onto the first and second conducting pads and the first surface of the dielectric structure core to fo…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.