Uniform passivation method for conductive features
US7413976B2 · kind B2 · utility
3Cited by
3References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2005 |
| Grant date | Aug 19, 2008 |
| Priority date | — |
| Expiry date | Dec 19, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The top surfaces of conductive features are treated with a treatment solution before forming a passivation layer over the conductive features. The treatment solution includes a cleaning solution and a chemical grafting precursor. The treatment solution may also include a leveling and wetting agent to improve coverage uniformity of the chemical grafting precursor. The method results in a uniform passivation layer formed over conductive features across a surface of a workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.