CMOS image sensor using gradient index chip scale lenses
US7414661B2 · kind B2 · utility
8Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2002 |
| Grant date | Aug 19, 2008 |
| Priority date | — |
| Expiry date | Oct 1, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/413
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A camera module includes a gradient index lens on a spacer plate attached over an array of pixel sensors and associated micro lenses. The spacer plate and gradient index lens can be formed at the wafer level during the manufacture of multiple camera modules. A process for manufacturing the camera modules thus provides tolerances and yields provided by wafer processing techniques rather than mechanical assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.