Method and system for failure signal detection analysis
US7415386B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 31, 2003 |
| Grant date | Aug 19, 2008 |
| Priority date | — |
| Expiry date | Dec 31, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B23/024
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A method for analyzing a sample of wafers includes identifying F failure metrics applicable to at least one pattern on each wafer within the sample. Z spatial and/or reticle zones are identified on each wafer, where Z and F are integers. Values are provided for each failure metric, for each zone on each wafer. A point is defined for each respective wafer in an N-dimensional space, where N=F*Z, and each point has coordinates corresponding to values of the F failure metrics in each of the zones of the corresponding wafer. The sample of wafers is partitioned into a plurality of clusters, so that the wafers within each clusters are close to each other in the N-dimensional space. A plurality of clusters is thus identified from the sample of wafers so that within each individual cluster, the wafers have similar defects to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.