Refractory metal substrate with improved thermal conductivity
US7416789B2 · kind B2 · utility
5Cited by
6References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 1, 2004 |
| Grant date | Aug 26, 2008 |
| Priority date | — |
| Expiry date | Nov 1, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate for semiconductor and integrated circuit components including: The substrate can be used in electronic devices, which can also include one or more semiconductor components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.