Nozzle assembly for applying a liquid to a substrate

US7419549B2 · kind B2 · utility

Assignees

• Steag HamaTech APE GmbH & Co. KG · DE
• Infineon Technologies AG · DE

Inventors

• Anatol Schwersenz · Öhringen, DE
• Werner Saule · Bretten, DE
• Andreas Nöring · Radolfzell, DE
• Peter Dress · Bruchsal, DE
• Christian Burgel · Birkenfeld, DE
• Martin Tschinkl · Birkenfeld, DE
• Marlene Strobl · Dresden, DE

Key dates

• Filing date: Jul 10, 2003
• Grant date: Sep 2, 2008
• Expiry date: Oct 25, 2024

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B05C5/005
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

The aim of the invention is to achieve a rapid, homogeneous application of a liquid with as little force as possible to a substrate. To achieve this, the invention provides a nozzle assembly (22) for applying a liquid to a substrate, said assembly having a nozzle body (26) comprising a plurality of nozzles (36) that are substantially arranged in a line and a guide plate (28) that extends essentially in a vertical direction with a straight lower edge. According to the invention, the nozzles (36) above the lower edge are directed towards the guide plate (28) in such a way that a film of liquid forms on the guide plate (28) and flows over the lower edge (64).