Methods and systems for rapid prototyping of high density circuits
US7419630B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2005 |
| Grant date | Sep 2, 2008 |
| Priority date | — |
| Expiry date | May 10, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y70/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A preferred embodiment provides, for example, a system and method of integrating fluid media dispensing technology such as direct-write (DW) technologies with rapid prototyping (RP) technologies such as stereolithography (SL) to provide increased micro-fabrication and micro-stereolithography. A preferred embodiment of the present invention also provides, for example, a system and method for Rapid Prototyping High Density Circuit (RPHDC) manufacturing of solderless connectors and pilot devices with terminal geometries that are compatible with DW mechanisms and reduce contact resistance where the electrical system is encapsulated within structural members and manual electrical connections are eliminated in favor of automated DW traces. A preferred embodiment further provides, for example, a method of rapid prototyping comprising: fabricating a part layer using stereolithography and depositing thermally curable media onto the part layer using a fluid dispensing apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.