Ryan Wicker
30Patents
10h-index
34Co-inventors
71Inventor score
Filing activity: May 29, 2003 → Dec 8, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7194120B2 | Methods and systems for image-guided placement of implants | Physics | 305 | Expired |
| US7556490B2 | Multi-material stereolithography | Performing Operations; Transporting | 87 | Active |
| US8252223B2 | Methods and systems for integrating fluid dispensing technology with stereolithography | Performing Operations; Transporting | 67 | Active |
| US8828311B2 | Reticulated mesh arrays and dissimilar array monoliths by additive layered manufacturing using electron and laser beam melting | Emerging Cross-Sectional Technologies | 57 | Active |
| US7959847B2 | Methods for multi-material stereolithography | Performing Operations; Transporting | 27 | Active |
| US7658603B2 | Methods and systems for integrating fluid dispensing technology with stereolithography | Performing Operations; Transporting | 23 | Active |
| US7780897B2 | Hydrogel constructs using stereolithography | Emerging Cross-Sectional Technologies | 21 | Active |
| US7419630B2 | Methods and systems for rapid prototyping of high density circuits | Performing Operations; Transporting | 20 | Active |
| US8197743B2 | Hydrogel constructs using stereolithography | Emerging Cross-Sectional Technologies | 17 | Active |
| US9414501B2 | Method for connecting inter-layer conductors and components in 3D structures | Emerging Cross-Sectional Technologies | 12 | Active |
| US9777380B2 | Multi-layered 3D printed laser direct structuring for electrical interconnect and antennas | Electricity | 8 | Active |
| US10518490B2 | Methods and systems for embedding filaments in 3D structures, structural components, and structural electronic, electromagnetic and electromechanical components/devices | Emerging Cross-Sectional Technologies | 7 | Active |
| US10748867B2 | Extrusion-based additive manufacturing system for 3D structural electronic, electromagnetic and electromechanical components/devices | Emerging Cross-Sectional Technologies | 4 | Active |
| US10259081B2 | Connecting metal foils/wires and components in 3D printed substrates with wire bonding | Electricity | 2 | Active |
| US10913202B2 | Structurally integrating metal objects into additive manufactured structures | Performing Operations; Transporting | 2 | Active |
| US9908037B2 | Electronic gaming die | Emerging Cross-Sectional Technologies | 1 | Active |
| US10610931B2 | Method and system for producing functionally graded structures in powder bed fusion processing | Emerging Cross-Sectional Technologies | 1 | Active |
| US11317515B2 | Wire embedding system with a curved delivery path | Electricity | 1 | Active |
| US10464306B2 | Metal objects spanning internal cavities in structures fabricated by additive manufacturing | Emerging Cross-Sectional Technologies | 1 | Active |
| US10569464B2 | Connecting metal foils/wires at different layers in 3D printed substrates with wire spanning | Performing Operations; Transporting | 1 | Active |
| US10449624B2 | Method of fabrication for the repair and augmentation of part functionality of metallic components | Emerging Cross-Sectional Technologies | 0 | Active |
| US10335673B2 | Electronic gaming die | Emerging Cross-Sectional Technologies | 0 | Active |
| US12019430B2 | Metal additive manufacturing qualification test artifact | Emerging Cross-Sectional Technologies | 0 | Active |
| US12036608B2 | Spectral emissivity and temperature measurements of metal powders during continuous processing in powder bed fusion additive manufacturing | Emerging Cross-Sectional Technologies | 0 | Active |
| US10582619B2 | Apparatus for wire handling and embedding on and within 3D printed parts | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.