Bonding an optical element to a light emitting device
US7419839B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2004 |
| Grant date | Sep 2, 2008 |
| Priority date | — |
| Expiry date | Jul 4, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B45/20
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A device is provided with at least one light emitting device (LED) die mounted on a submount with an optical element subsequently thermally bonded to the LED die. The LED die is electrically coupled to the submount through contact bumps that have a higher temperature melting point than is used to thermally bond the optical element to the LED die. In one implementation, a single optical element is bonded to a plurality of LED dice that are mounted to the submount and the submount and the optical element have approximately the same coefficients of thermal expansion. Alternatively, a number of optical elements may be used. The optical element or LED die may be covered with a coating of wavelength converting material. In one implementation, the device is tested to determine the wavelengths produced and additional layers of the wavelength converting material are added until the desired wavelengths are produced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.