Encapsulation of electroluminescent devices with shaped spacers

US7419842B2 · kind B2 · utility

Assignees

• OSRAM GmbH · DE
• AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH · SG

Inventors

• Mark Auch · Singapore, SG
• Ewald Guenther · Regenstauf, DE
• Soo Jin Chua · Singapore, SG

Key dates

• Filing date: Feb 12, 2007
• Grant date: Sep 2, 2008
• Expiry date: Feb 12, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K59/8722

Abstract

A method of encapsulating a device is disclosed. Spacer particles are randomly located in a device region to prevent a cap mounted on the substrate from contacting the active components when pressure is applied to the cap, thereby protecting the active components from damage. The spacer particles comprise a base and an upper portion, the base being at least equal to or wider than the upper portion.